| Mfr Part # | Qty | Price | Product Status | Module/Board Type | Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0807-03-7DI21-A
MPSOC ZYNQ USCALE 4GB DDR4
Trenz Electronic GmbH
|
3,155 | 1457.01000 | Active | MPU Core | Zynq UltraScale+ XCZU7EV-1FBVB900I | - | - | 128MB | 4GB | B2B | 2.05" x 2.99" (52mm x 76mm) | -40°C ~ 85°C | Details | |
|
5749-PM-4AA-RI
TEXAS INSTRUMENTS AM5749 SOM WIT
Critical Link LLC
|
5,693 | 466.38000 | Active | MPU, FPGA Core | ARM Cortex-A15 | Artix-7 | 1.5GHz | 32MB | 1GB | Edge Connector - 310, Board-to-Board (BTB) - 100 | 3.46" x 2.73" (87.88mm x 69.34mm) | -40°C ~ 85°C | Details | |
|
OSD32MP153C-512M-BAA
SIP: 153C, 512MB, BAA
Octavo Systems LLC
|
2,431 | 46.12024 | Active | MPU Core | Arm® Dual Cortex®-A7, Arm® Cortex®-M4 | NEON™ SIMD | 650MHz | - | 512MB | 302-BGA | 0.71" x 0.71" (18mm x 18mm) | 0°C ~ 85°C | Details | |
|
TE0803-04-3AE11-A
IC MODULE ZYNQ USCALE 2GB 128MB
Trenz Electronic GmbH
|
3,385 | 414.00000 | Active | MPU Core | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.05" x 2.99" (52mm x 76mm) | 0°C ~ 85°C | Details | |
|
TE0808-05-9GI21-A
USOM+ MPSOC ZYNQ USCALE FPGA
Trenz Electronic GmbH
|
9,554 | 1821.56000 | Active | MPU Core | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | - | 128MB | 4GB | B2B | 2.05" x 2.99" (52mm x 76mm) | -40°C ~ 85°C | Details | |
|
EZ80F920020MODG
IC MOD EZ80F92 20MHZ 8KB 128KB
Zilog
|
2,044 | 70.36000 | Active | MCU Core | eZ80F92 | - | 20MHz | 128KB | 8KB (Internal), 512KB (External) | Header 2x25 | 2.5" x 2.5" (64mm x 64mm) | 0°C ~ 70°C | Details | |
|
TE0741-04-A2I-1-A
MODULE FPGA KINTEX
Trenz Electronic GmbH
|
7,614 | 479.00000 | Active | FPGA Core | Xilinx Kintex-7 FPGA XC7K70T-2FBG676I | - | - | 32MB | - | Board-to-Board (BTB) Socket | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C | Details | |
|
EC-VA-H265-10B-60-1080-OPVIC-0000
ENCODER H265 HD VID/AUD 10BIT
System-On-Chip (SOC) Technologies Inc.
|
3,672 | 2655.00000 | Active | - | - | - | - | - | - | - | - | - | Details | |
|
TE0803-04-4DE21-L
IC MODULE ZYNQ USCALE 2GB 128MB
Trenz Electronic GmbH
|
8,561 | 628.00000 | Active | MPU Core | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | - | 128MB | 4GB | B2B | 2.05" x 2.99" (52mm x 76mm) | 0°C ~ 85°C | Details | |
|
TE0803-04-5DI21-A
IC MODULE ZYNQ USCALE 2GB 128MB
Trenz Electronic GmbH
|
9,055 | 1543.01000 | Active | MPU Core | Zynq UltraScale+ XCZU5EV-1SFVC784I | - | - | 128MB | 4GB | B2B | 2.05" x 2.99" (52mm x 76mm) | -40°C ~ 85°C | Details | |
|
EC-VA-H265-10B-60-4K-OPVIC-0000
ENCODER H265 4K VID/AUD 10BIT
System-On-Chip (SOC) Technologies Inc.
|
4,020 | 3186.25000 | Active | - | - | - | - | - | - | - | - | - | Details | |
|
OSD3358-512M-ICE
SIP;3358;512M;ICE
Octavo Systems LLC
|
9,322 | 47.58230 | Active | MPU Core | ARM® Cortex®-A8, AM3358 | - | 1GHz | - | 512MB | 400-BGA | 1.06" x 1.06" (27.0mm x 27.0mm) | -40°C ~ 85°C (TC) | Details | |
|
MOD5234-200IR
IC MOD COLDFIRE 147.5MHZ 8MB
NetBurner Inc.
|
6,720 | 189.95000 | Active | MCU, Ethernet Core | ColdFire 5234 | - | 147.5MHz | 2MB | 8MB | 10-Pin Header, 2x50 Header | 2.95" x 2" (74.9mm x 50.8mm) | -40°C ~ 85°C | Details | |
|
TE0745-02-92I31-F
MOD SOM DDR3L 1GB
Trenz Electronic GmbH
|
2,182 | 2004.01000 | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7045) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.05" x 2.99" (52mm x 76mm) | -40°C ~ 85°C | Details | |
|
TE0720-04-61Q33MA
IC SOC MODULE XILINX ZYNQ
Trenz Electronic GmbH
|
9,765 | 302.00000 | Active | Ethernet Core | ARM® Cortex®-A9 | - | - | 32MB | 1GB | Board-to-Board (BTB) Socket | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C | Details | |
|
TE0720-04-62I33MA
IC SOC MODULE XILINX ZYNQ
Trenz Electronic GmbH
|
1,611 | 307.00000 | Active | Ethernet Core | ARM® Cortex®-A9 | - | - | 32MB | 1GB | Board-to-Board (BTB) Socket | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C | Details | |
|
MYC-YA151C-256N256D-65-C-T
MYC-YA15XC-T CPU MODULE,ST SOM
MYIR Tech Limited
|
5 | 21.00000 | Active | MPU Core | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | 650MHz | 256MB | 256MB | Pin Header | 1.54" x 1.46" (39mm x 37mm) | 0°C ~ 70°C | Details | |
|
MYC-YA151C-4E512D-65-C-T
MYC-YA15XC-T CPU MODULE,ST SOM
MYIR Tech Limited
|
5 | 33.00000 | Active | MPU Core | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | 650MHz | 4GB | 512MB | Pin Header | 1.54" x 1.46" (39mm x 37mm) | 0°C ~ 70°C | Details | |
|
MYC-YA151C-4E512D-65-I-T
MYC-YA15XC-T CPU MODULE,ST SOM
MYIR Tech Limited
|
5 | 39.00000 | Active | MPU Core | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | 650MHz | 4GB | 512MB | Pin Header | 1.54" x 1.46" (39mm x 37mm) | -40°C ~ 85°C | Details | |
|
TE0890-01-P1C-5-A
MOD SPARTAN-7 64MB FLASH SO8W
Trenz Electronic GmbH
|
7,152 | 47.00000 | Active | FPGA Core | Xilinx Spartan-7 XC7S25 | - | 100MHz | 64Mbit | 64Mbit | Dual-pinout DIP-40 or 50mil 80 pin connector | 1.06" x 2.05" (27.0mm x 52.0mm) | 0°C ~ 70°C | Details | |
|
TE0803-04-5DE11-A
IC MODULE ZYNQ USCALE 2GB 128MB
Trenz Electronic GmbH
|
2,965 | 1275.00000 | Active | MPU Core | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.05" x 2.99" (52mm x 76mm) | 0°C ~ 85°C | Details | |
|
TE0729-02-62I63MAK
IC SOC MODULE ZYNQ
Trenz Electronic GmbH
|
4 | 366.30000 | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7020) | - | 32MB | 512MB | B2B | 2.05" x 2.99" (52mm x 76mm) | -40°C ~ 85°C | Details | |
|
OSD32MP153C-512M-IAA
SIP: 153C, 512MB, IAA
Octavo Systems LLC
|
8,593 | 48.06024 | Active | MPU Core | Arm® Dual Cortex®-A7, Arm® Cortex®-M4 | NEON™ SIMD | 650MHz | - | 512MB | 302-BGA | 0.71" x 0.71" (18mm x 18mm) | -40°C ~ 85°C | Details | |
|
WIZ550WEB
IC MODULE CORTEX-M3 8MB
WIZnet
|
3,047 | 49.99400 | Active | MCU Core | ARM® Cortex®-M3 | - | - | 8MB | - | RJ-45, 2.54mm Headers | 1.18" x 2.93" (30mm x 74.4mm) | - | Details |
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