FERRI-EMCC 3D 20GB SLC 153BGA
SM662PAC-BESS is a Memory manufactured by Silicon Motion, Inc.. FERRI-EMCC 3D 20GB SLC 153BGA. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 105°C, package / case 100-LBGA, memory size 160Gb (20G x 8).
In Stock: 3,904
| Product Status | Active |
|---|---|
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC), FLASH - NAND (TLC) |
| Memory Size | 160Gb (20G x 8) |
| Memory Interface | eMMC |
| Clock Frequency | - |
| Write Cycle Time - Word, Page | - |
|---|---|
| Access Time | - |
| Voltage - Supply | - |
| Operating Temperature | -40°C ~ 105°C |
| Mounting Type | Surface Mount |
| Package / Case | 100-LBGA |
| Supplier Device Package | 100-BGA (14x18) |
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