UPD70F3557AM1GMA1-GBK-AX

In Stock: 7,542
UPD70F3557AM1GMA1-GBK-AX - Renesas Electronics America Inc - Embedded - Microcontrollers
REF: UPD70F3557AM1GMA1-GBK-AX Renesas Electronics America Inc
UPD70F3557AM1GMA1-GBK-AX

Renesas Electronics America Inc

IC MCU 32BIT 1.5MB FLSH 176HLQFP

UPD70F3557AM1GMA1-GBK-AX is a Embedded - Microcontrollers manufactured by Renesas Electronics America Inc. IC MCU 32BIT 1.5MB FLSH 176HLQFP. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 110°C (TA), voltage - supply (vcc/vdd) 3V ~ 5.5V, package / case 176-LQFP Exposed Pad.

In Stock: 7,542

Specifications

18 parameters
Product StatusObsolete
Core ProcessorV850E2
Core Size32-Bit Single-Core
Speed80MHz
ConnectivityCANbus, CSI, I²C, LINbus, UART/USART
PeripheralsDMA, PWM, WDT
Number of I/O136
Program Memory Size1.5MB (1.5M x 8)
Program Memory TypeFLASH
EEPROM Size64K x 8
RAM Size112K x 8
Voltage - Supply (Vcc/Vdd)3V ~ 5.5V
Data ConvertersA/D 40x12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 110°C (TA)
Mounting TypeSurface Mount
Package / Case176-LQFP Exposed Pad
Supplier Device Package176-HLQFP (24x24)

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