RFQ List My Parts 0
Get a Quote Contact

MT29F32G08CBADAL83A3WC1-M

In Stock: 7,472
MT29F32G08CBADAL83A3WC1-M - Micron Technology Inc. - Memory
REF: MT29F32G08CBADAL83A3WC1-M Micron Technology Inc.
MT29F32G08CBADAL83A3WC1-M

Micron Technology Inc.

IC FLASH 32GBIT PARALLEL DIE

MT29F32G08CBADAL83A3WC1-M is a Memory manufactured by Micron Technology Inc.. IC FLASH 32GBIT PARALLEL DIE. Key specifications: mounting type Surface Mount, operating temperature 0°C ~ 70°C (TA), voltage - supply 2.7V ~ 3.6V, package / case Die.

Request a Quote

In Stock: 7,472

Specifications

14 parameters
Product StatusObsolete
Memory TypeNon-Volatile
Memory FormatFLASH
TechnologyFLASH - NAND
Memory Size32Gb (4G x 8)
Memory InterfaceParallel
Clock Frequency-
Write Cycle Time - Word, Page-
Access Time-
Voltage - Supply2.7V ~ 3.6V
Operating Temperature0°C ~ 70°C (TA)
Mounting TypeSurface Mount
Package / CaseDie
Supplier Device PackageDie

Related Products

MT25QL512ABB8E12-0SIT - Micron Technology Inc. Micron Technology Inc. MT25QL512ABB8E12-0SIT 8.22000 RFQ JS28F128J3F75B TR - Micron Technology Inc. Micron Technology Inc. JS28F128J3F75B TR 5.04061 RFQ S29GL01GP12TFI023 - Flip Electronics Flip Electronics S29GL01GP12TFI023 15.27000 RFQ HN27C256AG15 - Renesas Electronics America Inc Renesas Electronics America Inc HN27C256AG15 9.69000 RFQ CY7C1370S-200AXCKJ - Rochester Electronics, LLC Rochester Electronics, LLC CY7C1370S-200AXCKJ 27.20000 RFQ S29GL128P11TFI020 - Infineon Technologies Infineon Technologies S29GL128P11TFI020 7.08000 RFQ

Manufacturers in Memory

Intel ISSI, Integrated Silicon Solution Inc Rochester Electronics, LLC Winbond Electronics Alliance Memory, Inc. Macronix ATP Electronics, Inc. Silicon Motion, Inc. Flip Electronics GSI Technology Inc. GigaDevice Semiconductor (HK) Limited Everspin Technologies Inc.

Need a Quote for MT29F32G08CBADAL83A3WC1-M?

Submit your RFQ and get a quote within 24 hours.

Submit RFQ View All Memory
Need components fast? Get pricing & lead time within 24 hours. Submit an RFQ →