ATSAMHA1G17A-MZT-BVAO

In Stock: 5,831
ATSAMHA1G17A-MZT-BVAO - Microchip Technology - Embedded - Microcontrollers
REF: ATSAMHA1G17A-MZT-BVAO Microchip Technology
ATSAMHA1G17A-MZT-BVAO

Microchip Technology

LIN SYSTEM IN PACKAGE SIP (MCU +

ATSAMHA1G17A-MZT-BVAO is a Embedded - Microcontrollers manufactured by Microchip Technology. LIN SYSTEM IN PACKAGE SIP (MCU +. Key specifications: mounting type Surface Mount, Wettable Flank, operating temperature -40°C ~ 115°C (TC), voltage - supply (vcc/vdd) 5V ~ 28V, package / case 48-VFQFN Exposed Pad.

In Stock: 5,831

Specifications

18 parameters
Product StatusActive
Core ProcessorARM® Cortex®-M0+
Core Size32-Bit Single-Core
Speed48MHz
ConnectivityI²C, LINbus SBC, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O32
Program Memory Size128KB (128K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size16K x 8
Voltage - Supply (Vcc/Vdd)5V ~ 28V
Data ConvertersA/D 13x12b; D/A 1x10b
Oscillator TypeExternal, Internal
Operating Temperature-40°C ~ 115°C (TC)
Mounting TypeSurface Mount, Wettable Flank
Package / Case48-VFQFN Exposed Pad
Supplier Device Package48-VQFN (7x7)

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